Købe EPF10K50VBC356-3 med BYCHPS
Køb med garanti
EPF10K50VBC356-3
- Varenummer:
- EPF10K50VBC356-3
- Fabrikant:
- Altera (Intel)
- Beskrivelse:
- IC FPGA 274 I/O 356BGA
- Blyfri Status / RoHS Status:
- Indeholder bly / RoHS ikke-kompatibel
- Tilgængelig mængde:
- 16545 Pieces
Introduktion
BYCHIPS er strømforsyningsdistributøren for EPF10K50VBC356-3, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til EPF10K50VBC356-3 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Forsyning: | 3 V ~ 3.6 V |
|---|---|
| Samlet RAM-bit: | 20480 |
| Leverandør Device Package: | 356-BGA (35x35) |
| Serie: | FLEX-10K® |
| Pakke / tilfælde: | 356-LBGA |
| Andre navne: | 544-1946 EPF10K50VBC356-3-ND |
| Driftstemperatur: | 0°C ~ 70°C (TA) |
| Antal logiske elementer / celler: | 2880 |
| Antal LAB'er / CLB'er: | 360 |
| Antal I / O: | 274 |
| Antal porte: | 116000 |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 3 (168 Hours) |
| Producentens varenummer: | EPF10K50VBC356-3 |
| Beskrivelse: | IC FPGA 274 I/O 356BGA |
| Email: | [email protected] |
Relaterede dele til EPF10K50VBC356-3
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
EPF10K50VBC356-2N | Altera | IC FPGA 274 I/O 356BGA | Forespørgsel |
|
EPF10K50VBC356-1N | Altera | IC FPGA 274 I/O 356BGA | Forespørgsel |
|
EPF10K50VBC356-1 | Altera | IC FPGA 274 I/O 356BGA | Forespørgsel |
|
EPF10K50VBC356-3N | Altera | IC FPGA 274 I/O 356BGA | Forespørgsel |
|
EPF10K50VBC356-4N | Altera | IC FPGA 274 I/O 356BGA | Forespørgsel |
|
EPF10K50VBC356-2 | Altera | IC FPGA 274 I/O 356BGA | Forespørgsel |
|
EPF10K50VBC356-4 | Altera | IC FPGA 274 I/O 356BGA | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog