Købe EPM1270GF256C3N med BYCHPS
Køb med garanti
EPM1270GF256C3N
- Varenummer:
- EPM1270GF256C3N
- Fabrikant:
- Altera (Intel)
- Beskrivelse:
- IC CPLD 980MC 6.2NS 256FBGA
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 12546 Pieces
Introduktion
BYCHIPS er strømforsyningsdistributøren for EPM1270GF256C3N, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til EPM1270GF256C3N via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsforsyning - Intern: | 1.71 V ~ 1.89 V |
|---|---|
| Leverandør Device Package: | 256-FBGA (17x17) |
| Serie: | MAX® II |
| Programmerbar Type: | In System Programmable |
| Emballage: | Tray |
| Pakke / tilfælde: | 256-BGA |
| Andre navne: | 544-1382 EPM1270GF256C3N-ND |
| Driftstemperatur: | 0°C ~ 85°C (TJ) |
| Antal makroceller: | 980 |
| Antal logiske elementer / blokke: | 1270 |
| Antal I / O: | 212 |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 3 (168 Hours) |
| Fabrikantens standard ledetid: | 12 Weeks |
| Producentens varenummer: | EPM1270GF256C3N |
| Beskrivelse: | IC CPLD 980MC 6.2NS 256FBGA |
| Forsinkelsestid tpd (1) Maks: | 6.2ns |
| Email: | [email protected] |
Relaterede dele til EPM1270GF256C3N
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
EPM1270GF256I5N | Altera | IC CPLD 980MC 6.2NS 256FBGA | Forespørgsel |
|
EPM1270GF256C4 | Altera | IC CPLD 980MC 6.2NS 256FBGA | Forespørgsel |
|
EPM1270GF256C5N | Altera | IC CPLD 980MC 6.2NS 256FBGA | Forespørgsel |
|
EPM1270GF256C3 | Altera | IC CPLD 980MC 6.2NS 256FBGA | Forespørgsel |
|
EPM1270GF256C5 | Altera | IC CPLD 980MC 6.2NS 256FBGA | Forespørgsel |
|
EPM1270GF256C4N | Altera | IC CPLD 980MC 6.2NS 256FBGA | Forespørgsel |
|
EPM1270GF256I5 | Altera | IC CPLD 980MC 6.2NS 256FBGA | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers