Købe FCB-405-0622M med BYCHPS
Køb med garanti
FCB-405-0622M
- Varenummer:
- FCB-405-0622M
- Beskrivelse:
- RELAY GEN PURPOSE 4PDT 5A 28V
- Blyfri Status / RoHS Status:
- Indeholder bly / RoHS ikke-kompatibel
- Tilgængelig mængde:
- 17622 Pieces
- Datablad:
- FCB-405-0622M.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for FCB-405-0622M, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til FCB-405-0622M via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Tænd for spænding (maks.): | 18 VDC |
|---|---|
| Sluk spænding (Min): | 1.5 VDC |
| Afslutningsstil: | Plug In |
| Skiftespænding: | 115VAC, 28VDC - Max |
| Serie: | Military, MIL-R-83536/6, FCB, CII |
| Udgivelsestid: | 6ms |
| Relæ Type: | General Purpose |
| Emballage: | Bulk |
| Andre navne: | 1122-1123 1122-1123-MIL 8-1617760-3 A101685 A101685-ND FCB-405-0622M-ND FCB4050622M M83536/6-022M |
| Driftstemperatur: | -70°C ~ 125°C |
| Brug tid: | 6ms |
| Monteringstype: | Chassis Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 19 Weeks |
| Producentens varenummer: | FCB-405-0622M |
| Funktioner: | Sealed - Hermetically |
| Udvidet beskrivelse: | General Purpose Relay 4PDT (4 Form C) 28VDC Coil Chassis Mount |
| Beskrivelse: | RELAY GEN PURPOSE 4PDT 5A 28V |
| Kontakt Rating (Aktuel): | 5A |
| Kontaktmateriale: | - |
| Kontaktformular: | 4PDT (4 Form C) |
| Spole spænding: | 28VDC |
| Spole type: | Non Latching |
| Coil Resistance: | 400 Ohms |
| Coil Power: | - |
| Email: | [email protected] |
Relaterede dele til FCB-405-0622M
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers