Købe FGP15N60UNDF med BYCHPS
Køb med garanti
FGP15N60UNDF
- Varenummer:
- FGP15N60UNDF
- Fabrikant:
- Fairchild/ON Semiconductor
- Beskrivelse:
- IGBT 600V 30A 178W TO220-3
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 13909 Pieces
- Datablad:
- 1.FGP15N60UNDF.pdf2.FGP15N60UNDF.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for FGP15N60UNDF, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til FGP15N60UNDF via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Samler Emitter Opdeling (Max): | 600V |
|---|---|
| Vce (på) (Max) @ Vge, Ic: | 2.7V @ 15V, 15A |
| Testtilstand: | 400V, 15A, 10 Ohm, 15V |
| Td (tænd / sluk) @ 25 ° C: | 9.3ns/54.8ns |
| Skifte energi: | 370µJ (on), 67µJ (off) |
| Leverandør Device Package: | TO-220-3 |
| Serie: | - |
| Reverse Recovery Time (trr): | 82.4ns |
| Strøm - Max: | 178W |
| Emballage: | Tube |
| Pakke / tilfælde: | TO-220-3 |
| Driftstemperatur: | -55°C ~ 150°C (TJ) |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 35 Weeks |
| Producentens varenummer: | FGP15N60UNDF |
| Input Type: | Standard |
| IGBT Type: | NPT |
| Gate Charge: | 43nC |
| Udvidet beskrivelse: | IGBT NPT 600V 30A 178W Through Hole TO-220-3 |
| Beskrivelse: | IGBT 600V 30A 178W TO220-3 |
| Nuværende - Collector Pulsed (Icm): | 45A |
| Nuværende - Samler (Ic) (Max): | 30A |
| Email: | [email protected] |
Relaterede dele til FGP15N60UNDF
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog