Købe FNA51060T3 med BYCHPS
Køb med garanti
FNA51060T3
- Varenummer:
- FNA51060T3
- Fabrikant:
- Fairchild/ON Semiconductor
- Beskrivelse:
- MODULE SPM 600V 10A SPM55
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 17853 Pieces
- Datablad:
- FNA51060T3.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for FNA51060T3, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til FNA51060T3 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Isolering: | 1500Vrms |
|---|---|
| Spænding: | 600V |
| Type: | IGBT |
| Serie: | Motion-SPM® |
| Pakke / tilfælde: | 20-PowerDIP Module (1.220", 31.00mm) |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 21 Weeks |
| Producentens varenummer: | FNA51060T3 |
| Udvidet beskrivelse: | Power Driver Module IGBT 3 Phase Inverter 600V 10A 20-PowerDIP Module (1.220", 31.00mm) |
| Beskrivelse: | MODULE SPM 600V 10A SPM55 |
| Nuværende: | 10A |
| Konfiguration: | 3 Phase Inverter |
| Email: | [email protected] |
Relaterede dele til FNA51060T3
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
FSB50250AS | Fairchild/ON Semiconductor | MODULE SPM 500V 1.2A SPM5Q | Forespørgsel |
 |
FNA51560TD3 | Fairchild/ON Semiconductor | MODULE SPM 600V 15A SPM55 | Forespørgsel |
 |
PM150RLB060 | Powerex Inc. | MOD IPM L-SER 7PAC 600V 150A | Forespørgsel |
 |
FNA51560T3 | Fairchild/ON Semiconductor | MODULE SPM 600V 15A SPM55 | Forespørgsel |
 |
FSBB20CH60 | Fairchild/ON Semiconductor | SMART POWER MODULE 20A SPM27-CA | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers