Købe FPF1C2P5MF07AM med BYCHPS
Køb med garanti
FPF1C2P5MF07AM
- Varenummer:
- FPF1C2P5MF07AM
- Fabrikant:
- Fairchild/ON Semiconductor
- Beskrivelse:
- 620V 30A DC/AC HIGH POWER MOD
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 12805 Pieces
- Datablad:
- FPF1C2P5MF07AM.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for FPF1C2P5MF07AM, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til FPF1C2P5MF07AM via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Samler Emitter Opdeling (Max): | 620V |
|---|---|
| Vce (på) (Max) @ Vge, Ic: | 1.6V @ 15V, 30A |
| Leverandør Device Package: | F1 |
| Serie: | - |
| Strøm - Max: | 231W |
| Pakke / tilfælde: | F1 Module |
| Driftstemperatur: | -40°C ~ 150°C (TJ) |
| NTC termistor: | No |
| Monteringstype: | Chassis Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | FPF1C2P5MF07AM |
| Inputkapacitans (Cies) @ Vce: | - |
| Input: | Single Phase Bridge Rectifier |
| IGBT Type: | - |
| Udvidet beskrivelse: | IGBT Module Full Bridge Inverter 620V 39A 231W Chassis Mount F1 |
| Beskrivelse: | 620V 30A DC/AC HIGH POWER MOD |
| Nuværende - Collector Cutoff (Max): | 25µA |
| Nuværende - Samler (Ic) (Max): | 39A |
| Konfiguration: | Full Bridge Inverter |
| Email: | [email protected] |
Relaterede dele til FPF1C2P5MF07AM
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
FP7G100US60 | Fairchild/ON Semiconductor | MODULE SPM 600V 100A EPM7 | Forespørgsel |
 |
FPF1C2P5BF07A | Fairchild/ON Semiconductor | MOSFET 5N-CH 650V 36A F1 MODULE | Forespørgsel |
 |
MIO 600-65E11 | IXYS | MOD IGBT SGL SWITCH 6500V E11 | Forespørgsel |
 |
IRG5W50HF06A | Infineon Technologies | MOD IGBT 600V 50A POWIR 34 | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers