Købe FR0H105ZF med BYCHPS
Køb med garanti
FR0H105ZF
- Varenummer:
- FR0H105ZF
- Fabrikant:
- KEMET
- Beskrivelse:
- CAP 1F -20% +80% 5.5V T/H
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 15098 Pieces
- Datablad:
- FR0H105ZF.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for FR0H105ZF, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til FR0H105ZF via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering: | 5.5V |
|---|---|
| Tolerance: | -20%, +80% |
| Afslutning: | Through Hole |
| Størrelse / Dimension: | 0.846" Dia (21.50mm) |
| Serie: | FR |
| Emballage: | Bulk |
| Pakke / tilfælde: | Radial, Can |
| Andre navne: | 399-10808 |
| Driftstemperatur: | -40°C ~ 85°C |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 16 Weeks |
| Producentens varenummer: | FR0H105ZF |
| Levetid @ Temp.: | - |
| Blyafstand: | 0.300" (7.62mm) |
| Højde - Siddende (Max): | 0.866" (22.00mm) |
| Udvidet beskrivelse: | 1F -20%, +80%(EDLC) Supercapacitor 5.5V Radial, Can 60 Ohm @ 1kHz |
| ESR (Equivalent Series Resistance): | 60 Ohm @ 1kHz |
| Beskrivelse: | CAP 1F -20% +80% 5.5V T/H |
| kapacitans: | 1F |
| Email: | [email protected] |
Relaterede dele til FR0H105ZF
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
BCAP0025 P270 T11 | Maxwell Technologies Inc. | CAP 25F 2.7V THROUGH HOLE | Forespørgsel |
 |
MAL219691225E3 | Vishay BC Components | CAP ALUM 15F 7.0V SNAP | Forespørgsel |
 |
657DCN2R7SZZ | Illinois Capacitor | CAPACITOR 650F 2.7V SNAP IN | Forespørgsel |
 |
PA-5R0H474-R | Eaton | CAP 470MF -20% +80% 5V T/H | Forespørgsel |
 |
PB-5R0V104-R | Eaton | CAP 100MF -20% +80% 5V T/H | Forespørgsel |
 |
KR-5R5C224H-R | Eaton | CAP 220MF -20% +80% 5.5V T/H | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers