Købe FRN12JT5R60 med BYCHPS
Køb med garanti
FRN12JT5R60
- Varenummer:
- FRN12JT5R60
- Fabrikant:
- Stackpole Electronics, Inc.
- Beskrivelse:
- RES FUSE 5.6 OHM 1/2W 5% AXIAL
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 12983 Pieces
- Datablad:
- 1.FRN12JT5R60.pdf2.FRN12JT5R60.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for FRN12JT5R60, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til FRN12JT5R60 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Tolerance: | ±5% |
|---|---|
| Temperaturkoefficient: | ±350ppm/°C |
| Leverandør Device Package: | Axial |
| Størrelse / Dimension: | 0.118" Dia x 0.354" L (3.00mm x 9.00mm) |
| Serie: | FRN |
| Modstand (ohm): | 5.6 |
| Power (Watts): | 0.5W, 1/2W |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | Axial |
| Andre navne: | FRN 1/2 5.6 5% R FRN1/25.65%R FRN1/25.65%R-ND FRN1/25.6JR FRN1/25.6JR-ND |
| Driftstemperatur: | -40°C ~ 155°C |
| Antal Afslutninger: | 2 |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 10 Weeks |
| Producentens varenummer: | FRN12JT5R60 |
| Højde - Siddende (Max): | - |
| Funktioner: | Flame Proof, Fusible, Moisture Resistant, Safety |
| Fejlrate: | - |
| Udvidet beskrivelse: | 5.6 Ohm ±5% 0.5W, 1/2W Through Hole Resistor Axial Flame Proof, Fusible, Moisture Resistant, Safety Metal Film |
| Beskrivelse: | RES FUSE 5.6 OHM 1/2W 5% AXIAL |
| Sammensætning: | Metal Film |
| Email: | [email protected] |
Relaterede dele til FRN12JT5R60
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers