Købe FSB50250UTD med BYCHPS
Køb med garanti
FSB50250UTD
- Varenummer:
- FSB50250UTD
- Fabrikant:
- Fairchild/ON Semiconductor
- Beskrivelse:
- MOD SPM 500V 1.1A SPM23-ED
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 16836 Pieces
- Datablad:
- FSB50250UTD.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for FSB50250UTD, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til FSB50250UTD via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Isolering: | 1500Vrms |
|---|---|
| Spænding: | 500V |
| Type: | MOSFET |
| Serie: | Motion-SPM® |
| Pakke / tilfælde: | 23-PowerDIP Module (0.748", 19.00mm) |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | FSB50250UTD |
| Udvidet beskrivelse: | Power Driver Module MOSFET 3 Phase 500V 1.1A 23-PowerDIP Module (0.748", 19.00mm) |
| Beskrivelse: | MOD SPM 500V 1.1A SPM23-ED |
| Nuværende: | 1.1A |
| Konfiguration: | 3 Phase |
| Email: | [email protected] |
Relaterede dele til FSB50250UTD
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
FSB50250 | Fairchild/ON Semiconductor | IC SMART POWER MOD 2A SPM23-AA | Forespørgsel |
 |
FSB50250AS | Fairchild/ON Semiconductor | MODULE SPM 500V 1.2A SPM5Q | Forespørgsel |
 |
FSB50250S | Fairchild/ON Semiconductor | IC SMART POWER MOD 2A SPM23-BA | Forespørgsel |
 |
FSB50250UD | Fairchild/ON Semiconductor | MOD SPM 500V 1.1A SPM23-HD | Forespørgsel |
 |
FSB50250AT | Fairchild/ON Semiconductor | MODULE SPM 500V 1.2A SPM5N | Forespørgsel |
 |
FSB50250AB | Fairchild/ON Semiconductor | FET 3PH 500V 1.2A MODULE | Forespørgsel |
 |
FSB50250A | Fairchild/ON Semiconductor | MODULE SPM 500V 1.2A SPM5P | Forespørgsel |
 |
FSB50250US | Fairchild/ON Semiconductor | MODULE SPM 500V 1.1A SPM23BD | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers