Købe FSBB30CH60CT med BYCHPS
Køb med garanti
FSBB30CH60CT
- Varenummer:
- FSBB30CH60CT
- Fabrikant:
- Fairchild/ON Semiconductor
- Beskrivelse:
- MODULE SPM 600V 30A SPMEC
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 14510 Pieces
- Datablad:
- FSBB30CH60CT.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for FSBB30CH60CT, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til FSBB30CH60CT via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Isolering: | 2500Vrms |
|---|---|
| Spænding: | 600V |
| Type: | IGBT |
| Serie: | Motion-SPM® |
| Pakke / tilfælde: | 27-PowerDIP Module (1.205", 30.60mm) |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 46 Weeks |
| Producentens varenummer: | FSBB30CH60CT |
| Udvidet beskrivelse: | Power Driver Module IGBT 3 Phase 600V 30A 27-PowerDIP Module (1.205", 30.60mm) |
| Beskrivelse: | MODULE SPM 600V 30A SPMEC |
| Nuværende: | 30A |
| Konfiguration: | 3 Phase |
| Email: | [email protected] |
Relaterede dele til FSBB30CH60CT
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
FSBB30CH60B | Fairchild/ON Semiconductor | MODULE SPM 600V 30A 3PH SPM27-EC | Forespørgsel |
 |
FSBB30CH60F | Fairchild/ON Semiconductor | IC SMART PWR MODULE SPM27-EA | Forespørgsel |
 |
FSBB30CH60 | Fairchild/ON Semiconductor | SMART POWER MODULE 30A SPM27-EA | Forespørgsel |
 |
FSBB30CH60C | Fairchild/ON Semiconductor | MODULE SPM 600V 30A SPMCC | Forespørgsel |
 |
FSBB30CH60D | Fairchild/ON Semiconductor | MODULE SPM 600V 30A SPMPA | Forespørgsel |
|
FSBB30CH60DF | Fairchild/ON Semiconductor | MODULE SPM 600V 30A SPMPA | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers