Købe FVP18030IM3LSG1 med BYCHPS
Køb med garanti
FVP18030IM3LSG1
- Varenummer:
- FVP18030IM3LSG1
- Fabrikant:
- Fairchild/ON Semiconductor
- Beskrivelse:
- MODULE SPM 300V VPM19-AA
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 14907 Pieces
- Datablad:
- FVP18030IM3LSG1.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for FVP18030IM3LSG1, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til FVP18030IM3LSG1 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Isolering: | 1500Vrms |
|---|---|
| Spænding: | 300V |
| Type: | IGBT |
| Serie: | SPM® |
| Pakke / tilfælde: | 19-PowerDIP Module (1.205", 30.60mm) |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | FVP18030IM3LSG1 |
| Udvidet beskrivelse: | Power Driver Module IGBT Half Bridge 300V 180A 19-PowerDIP Module (1.205", 30.60mm) |
| Beskrivelse: | MODULE SPM 300V VPM19-AA |
| Nuværende: | 180A |
| Konfiguration: | Half Bridge |
| Email: | [email protected] |
Relaterede dele til FVP18030IM3LSG1
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
PS12038 | Powerex Inc. | MOD IPM 3PHASE IGBT 1200V 25A | Forespørgsel |
 |
FPAB30BH60B | Fairchild/ON Semiconductor | MOD SPM 600V 30A SPM27-IC | Forespørgsel |
 |
FNA23512A | Fairchild/ON Semiconductor | MOD SPM 1200V 35A INVERTER | Forespørgsel |
|
PM150RSD060 | Powerex Inc. | MOD IPM 7PAC 600V 150A | Forespørgsel |
 |
FSB50450T | Fairchild/ON Semiconductor | IC SPM 500V 3.0A 3PH SPM23AC | Forespørgsel |
 |
PS22A76 | Powerex Inc. | MOD IPM 1200V 25A LARGE DIP | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers