Købe G5SBA60-E3/45 med BYCHPS
Køb med garanti
G5SBA60-E3/45
- Varenummer:
- G5SBA60-E3/45
- Fabrikant:
- Vishay / Semiconductor - Diodes Division
- Beskrivelse:
- DIODE GPP 1PH 6A 600V GBU
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 18885 Pieces
Introduktion
BYCHIPS er strømforsyningsdistributøren for G5SBA60-E3/45, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til G5SBA60-E3/45 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Peak Reverse (Max): | 600V |
|---|---|
| Spænding - Videresend (Vf) (Max) @ Hvis: | 1.05V @ 3A |
| Teknologi: | Standard |
| Leverandør Device Package: | GBU |
| Serie: | - |
| Emballage: | Tube |
| Pakke / tilfælde: | 4-SIP, GBU |
| Driftstemperatur: | -55°C ~ 150°C (TJ) |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | G5SBA60-E3/45 |
| Udvidet beskrivelse: | Bridge Rectifier Single Phase 600V 2.8A Through Hole GBU |
| Diodetype: | Single Phase |
| Beskrivelse: | DIODE GPP 1PH 6A 600V GBU |
| Nuværende - Reverse Lækage @ Vr: | 5µA @ 600V |
| Nuværende - Gennemsnitlig Rectified (Io): | 2.8A |
| Email: | [email protected] |
Relaterede dele til G5SBA60-E3/45
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers