Købe G6A-274P-ST15-US-DC24 med BYCHPS
Køb med garanti
G6A-274P-ST15-US-DC24
- Varenummer:
- G6A-274P-ST15-US-DC24
- Fabrikant:
- Omron
- Beskrivelse:
- RELAY GEN PURPOSE DPDT 2A 24V
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 15058 Pieces
- Datablad:
- G6A-274P-ST15-US-DC24.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for G6A-274P-ST15-US-DC24, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til G6A-274P-ST15-US-DC24 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Tænd for spænding (maks.): | 19.2 VDC |
|---|---|
| Sluk spænding (Min): | 2.4 VDC |
| Afslutningsstil: | PC Pin |
| Skiftespænding: | 250VAC, 220VDC - Max |
| Serie: | G6A |
| Udgivelsestid: | 3ms |
| Relæ Type: | General Purpose |
| Emballage: | Tube |
| Andre navne: | G6A 1669E G6A-274P-ST15-US-DC24-ND G6A274PST15US24DC G6A274PST15USDC24 Z6441 |
| Driftstemperatur: | -40°C ~ 70°C |
| Brug tid: | 5ms |
| Monteringstype: | Through Hole |
| Fabrikantens standard ledetid: | 11 Weeks |
| Producentens varenummer: | G6A-274P-ST15-US-DC24 |
| Funktioner: | - |
| Udvidet beskrivelse: | General Purpose Relay DPDT (2 Form C) Through Hole |
| Beskrivelse: | RELAY GEN PURPOSE DPDT 2A 24V |
| Kontakt Rating (Aktuel): | 2A |
| Kontaktmateriale: | Silver (Ag), Gold (Au) |
| Kontaktformular: | DPDT (2 Form C) |
| Spole spænding: | 24VDC |
| Spole type: | Non Latching |
| Coil Resistance: | 3.84 kOhms |
| Coil Power: | 150 mW |
| Coil Current: | 6.3mA |
| Email: | [email protected] |
Relaterede dele til G6A-274P-ST15-US-DC24
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers