Købe G6B-1174P-US DC3 med BYCHPS
Køb med garanti
G6B-1174P-US DC3
- Varenummer:
- G6B-1174P-US DC3
- Fabrikant:
- Omron
- Beskrivelse:
- RELAY GENERAL PURPOSE SPST 8A 3V
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 13050 Pieces
- Datablad:
- G6B-1174P-US DC3.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for G6B-1174P-US DC3, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til G6B-1174P-US DC3 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Tænd for spænding (maks.): | 2.1 VDC |
|---|---|
| Sluk spænding (Min): | 0.3 VDC |
| Afslutningsstil: | PC Pin |
| Skiftespænding: | 380VAC, 125VDC - Max |
| Serie: | G6B |
| Udgivelsestid: | 10ms |
| Relæ Type: | General Purpose |
| Emballage: | Bulk |
| Andre navne: | G6B1174PUSDC3 |
| Driftstemperatur: | -25°C ~ 70°C |
| Brug tid: | 10ms |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 12 Weeks |
| Producentens varenummer: | G6B-1174P-US DC3 |
| Funktioner: | Sealed - Fully |
| Udvidet beskrivelse: | General Purpose Relay SPST-NO (1 Form A) 3VDC Coil Through Hole |
| Beskrivelse: | RELAY GENERAL PURPOSE SPST 8A 3V |
| Kontakt Rating (Aktuel): | 8A |
| Kontaktmateriale: | Silver Alloy, Cadmium Free |
| Kontaktformular: | SPST-NO (1 Form A) |
| Spole spænding: | 3VDC |
| Spole type: | Non Latching |
| Coil Resistance: | 45 Ohms |
| Coil Power: | 200 mW |
| Coil Current: | 66.7mA |
| Email: | [email protected] |
Relaterede dele til G6B-1174P-US DC3
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers