Købe G8P1A2TFDC5BYOMZ med BYCHPS
Køb med garanti
G8P1A2TFDC5BYOMZ
- Varenummer:
- G8P1A2TFDC5BYOMZ
- Fabrikant:
- Omron
- Beskrivelse:
- RELAY GEN PURPOSE SPST 30A 5V
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 16643 Pieces
- Datablad:
- G8P1A2TFDC5BYOMZ.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for G8P1A2TFDC5BYOMZ, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til G8P1A2TFDC5BYOMZ via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Tænd for spænding (maks.): | 3.75 VDC |
|---|---|
| Sluk spænding (Min): | 0.5 VDC |
| Afslutningsstil: | Quick Connect - 0.187"/0.250" |
| Skiftespænding: | 250VAC, 28VDC - Max |
| Serie: | G8P |
| Udgivelsestid: | 10ms |
| Relæ Type: | General Purpose |
| Emballage: | Bulk |
| Andre navne: | G8P-1A2T-FDC5 G8P-1A2T-FDC5-ND G8P1A2TF5DC G8P1A2TFDC5 G8PT5061E G8PT6038F Z4406 |
| Driftstemperatur: | -55°C ~ 105°C |
| Brug tid: | 15ms |
| Monteringstype: | Chassis Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | G8P1A2TFDC5BYOMZ |
| Funktioner: | Insulation - Class F |
| Udvidet beskrivelse: | General Purpose Relay SPST-NO (1 Form A) 5VDC Coil Chassis Mount |
| Beskrivelse: | RELAY GEN PURPOSE SPST 30A 5V |
| Kontakt Rating (Aktuel): | 30A |
| Kontaktmateriale: | Silver Cadmium Oxide (AgCdO) |
| Kontaktformular: | SPST-NO (1 Form A) |
| Spole spænding: | 5VDC |
| Spole type: | Non Latching |
| Coil Resistance: | 27 Ohms |
| Coil Power: | 900 mW |
| Coil Current: | 185mA |
| Email: | [email protected] |
Relaterede dele til G8P1A2TFDC5BYOMZ
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers