Købe GB35XF120K med BYCHPS
Køb med garanti
GB35XF120K
- Varenummer:
- GB35XF120K
- Fabrikant:
- Vishay / Semiconductor - Diodes Division
- Beskrivelse:
- MODULE IGBT 1200V 35A ECONO2 6PK
- Blyfri Status / RoHS Status:
- Indeholder bly / RoHS ikke-kompatibel
- Tilgængelig mængde:
- 17430 Pieces
- Datablad:
- GB35XF120K.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for GB35XF120K, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til GB35XF120K via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Samler Emitter Opdeling (Max): | 1200V |
|---|---|
| Vce (på) (Max) @ Vge, Ic: | 3V @ 15V, 50A |
| Leverandør Device Package: | - |
| Serie: | - |
| Strøm - Max: | 284W |
| Pakke / tilfælde: | ECONO2 |
| Driftstemperatur: | 150°C (TJ) |
| NTC termistor: | No |
| Monteringstype: | Chassis Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | GB35XF120K |
| Inputkapacitans (Cies) @ Vce: | 3.475nF @ 30V |
| Input: | Standard |
| IGBT Type: | NPT |
| Udvidet beskrivelse: | IGBT Module NPT Three Phase Inverter 1200V 50A 284W Chassis Mount |
| Beskrivelse: | MODULE IGBT 1200V 35A ECONO2 6PK |
| Nuværende - Collector Cutoff (Max): | 100µA |
| Nuværende - Samler (Ic) (Max): | 50A |
| Konfiguration: | Three Phase Inverter |
| Email: | [email protected] |
Relaterede dele til GB35XF120K
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
MIAA15WD600TMH | IXYS | MODULE IGBT CBI | Forespørgsel |
 |
APTGT150DA120TG | Microsemi Corporation | IGBT 1200V 200A 690W SP4 | Forespørgsel |
 |
APTGL475U120D4G | Microsemi Corporation | IGBT4 SGL SWITCH 1200V 610A D4 | Forespørgsel |
 |
MG1215H-XBN2MM | Littelfuse Inc. | IGBT MOD 1200V 15A PKG H CRCT:XB | Forespørgsel |
 |
IXYN100N120C3 | IXYS | IGBT XPT 1200V 152A SOT-227B | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers