Købe GSG007 med BYCHPS
Køb med garanti
GSG007
- Varenummer:
- GSG007
- Fabrikant:
- Sprague Goodman
- Beskrivelse:
- CAP TRIM 1.2-16PF 500V PNL MOUNT
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 17257 Pieces
- Datablad:
- GSG007.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for GSG007, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til GSG007 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering: | 500V |
|---|---|
| Størrelse / Dimension: | 0.312" Dia x 0.312" L (7.92mm x 7.92mm) |
| Serie: | - |
| Emballage: | Bulk |
| Monteringstype: | Panel Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | GSG007 |
| Højde - Siddende (Max): | - |
| Funktioner: | General Purpose |
| Udvidet beskrivelse: | 1.2 ~ 16pF Trimmer Capacitor 500V Panel Mount |
| Beskrivelse: | CAP TRIM 1.2-16PF 500V PNL MOUNT |
| Kapacitansområde: | 1.2 ~ 16pF |
| Justeringstype: | - |
| Email: | [email protected] |
Relaterede dele til GSG007
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
GSG006 | Sprague-Goodman | CAP TRIM 1.2-10PF 500V PNL MOUNT | Forespørgsel |
 |
TZ03P450E169B00 | Murata Electronics North America | CAP TRIMMER 6.8-45PF 100V TH | Forespørgsel |
|
GXA27002 | Sprague-Goodman | CAP TRIM 3.9-27PF 100V THRU HOLE | Forespørgsel |
|
GSG009 | Sprague-Goodman | CAP TRIM 1.2-16PF 500V THRU HOLE | Forespørgsel |
 |
GXL10000 | Sprague-Goodman | CAP TRIM 1.8-10PF 300V THRU HOLE | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers