Købe GXF75000 med BYCHPS
Køb med garanti
GXF75000
- Varenummer:
- GXF75000
- Fabrikant:
- Sprague Goodman
- Beskrivelse:
- CAP TRIM 6-75PF 200V THRU HOLE
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 13255 Pieces
- Datablad:
- GXF75000.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for GXF75000, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til GXF75000 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering: | 200V |
|---|---|
| Størrelse / Dimension: | 0.433" L x 0.402" W (11.00mm x 10.20mm) |
| Serie: | - |
| Emballage: | Bulk |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | GXF75000 |
| Højde - Siddende (Max): | 0.449" (11.40mm) |
| Funktioner: | General Purpose |
| Udvidet beskrivelse: | 6 ~ 75pF Trimmer Capacitor 200V Top and Bottom Adjustment Through Hole |
| Beskrivelse: | CAP TRIM 6-75PF 200V THRU HOLE |
| Kapacitansområde: | 6 ~ 75pF |
| Justeringstype: | Top and Bottom Adjustment |
| Email: | [email protected] |
Relaterede dele til GXF75000
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
GXF75003 | Sprague-Goodman | CAP TRIM 6-75PF 200V THRU HOLE | Forespørgsel |
|
GXF75004 | Sprague-Goodman | CAP TRIM 6-75PF 200V THRU HOLE | Forespørgsel |
|
GWF8R000 | Sprague-Goodman | CAP TRIM 0.8-8PF 500V | Forespørgsel |
|
PC52J5R5 | Sprague-Goodman | CAP TRIMMER 0.8-5.5PF 750V T/H | Forespørgsel |
|
GWL2R500 | Sprague-Goodman | CAP TRIM 0.4-2.5PF 500V SURF MNT | Forespørgsel |
|
GMC30100 | Sprague-Goodman | CAP TRIM 3.5-25PF 175V THRU HOLE | Forespørgsel |
 |
SGNMNC3806E | Sprague-Goodman | CAP TRIM 5-85PF 6KV CHASS MNT | Forespørgsel |
 |
NMAJ25HV | Knowles Voltronics | CAP TRIMMER 1-23PF 750V SMD | Forespørgsel |
|
SGNMNC2406E | Sprague-Goodman | CAP TRIM 4-40PF 6KV CHASS MNT | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers