Købe GYC15004 med BYCHPS
Køb med garanti
GYC15004
- Varenummer:
- GYC15004
- Fabrikant:
- Sprague Goodman
- Beskrivelse:
- CAP TRIM 2.15PF 100V THRU HOLE
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 13732 Pieces
- Datablad:
- GYC15004.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for GYC15004, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til GYC15004 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering: | 100V |
|---|---|
| Størrelse / Dimension: | 0.433" L x 0.374" W (11.00mm x 9.50mm) |
| Serie: | FILMTRIM® |
| Emballage: | Bulk |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | GYC15004 |
| Højde - Siddende (Max): | 0.402" (10.20mm) |
| Funktioner: | General Purpose |
| Udvidet beskrivelse: | 2 ~ 15pF Trimmer Capacitor 100V Top and Bottom Adjustment Through Hole |
| Beskrivelse: | CAP TRIM 2.15PF 100V THRU HOLE |
| Kapacitansområde: | 2 ~ 15pF |
| Justeringstype: | Top and Bottom Adjustment |
| Email: | [email protected] |
Relaterede dele til GYC15004
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
GXD90000 | Sprague-Goodman | CAP TRIM 8-90PF 100V THRU HOLE | Forespørgsel |
|
GZN30100 | Sprague-Goodman | CAP TRIM 18-300PF 150V THRU HOLE | Forespørgsel |
|
GYC15003 | Sprague-Goodman | CAP TRIM 2-15PF 100V THRU HOLE | Forespørgsel |
 |
0538-006-D-9.0-35 | Tusonix a Subsidiary of CTS Electronic Components | TRIMMER | Forespørgsel |
 |
GYC15000 | Sprague-Goodman | CAP TRIMMER 2-15PF 100V TH | Forespørgsel |
|
GMD40200 | Sprague-Goodman | CAP TRIM 10-80PF 175V THRU HOLE | Forespørgsel |
|
GNF8R050 | Sprague-Goodman | CAP TRIM 0.8-8PF 500V | Forespørgsel |
|
GMC40800 | Sprague-Goodman | CAP TRIM 175-680PF 175V T/H | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers