Købe H824R3BDA med BYCHPS
Køb med garanti
H824R3BDA
- Varenummer:
- H824R3BDA
- Fabrikant:
- AMP Connectors / TE Connectivity
- Beskrivelse:
- RES 24.3 OHM 1/4W 0.1% AXIAL
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 17544 Pieces
- Datablad:
- 1.H824R3BDA.pdf2.H824R3BDA.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for H824R3BDA, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til H824R3BDA via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Tolerance: | ±0.1% |
|---|---|
| Temperaturkoefficient: | ±25ppm/°C |
| Leverandør Device Package: | Axial |
| Størrelse / Dimension: | 0.098" Dia x 0.283" L (2.50mm x 7.20mm) |
| Serie: | Holco, Holsworthy |
| Modstand (ohm): | 24.3 |
| Power (Watts): | 0.25W, 1/4W |
| Emballage: | Bulk |
| Pakke / tilfælde: | Axial |
| Andre navne: | 3-1879672-8 3-1879672-8-ND |
| Driftstemperatur: | -55°C ~ 155°C |
| Antal Afslutninger: | 2 |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 17 Weeks |
| Producentens varenummer: | H824R3BDA |
| Højde - Siddende (Max): | - |
| Funktioner: | Pulse Withstanding |
| Fejlrate: | - |
| Udvidet beskrivelse: | 24.3 Ohm ±0.1% 0.25W, 1/4W Through Hole Resistor Axial Pulse Withstanding Metal Film |
| Beskrivelse: | RES 24.3 OHM 1/4W 0.1% AXIAL |
| Sammensætning: | Metal Film |
| Email: | [email protected] |
Relaterede dele til H824R3BDA
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers