Købe HD3-6402R-9Z med BYCHPS
Køb med garanti
HD3-6402R-9Z
- Varenummer:
- HD3-6402R-9Z
- Fabrikant:
- Intersil
- Beskrivelse:
- IC UART CMOS 5V 2MHZ 40-DIP
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 15210 Pieces
- Datablad:
- HD3-6402R-9Z.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for HD3-6402R-9Z, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til HD3-6402R-9Z via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Med Modem Control: | - |
|---|---|
| Med IrDA Encoder / dekoder: | - |
| Med False Start Bit Detection: | - |
| Med automatisk strømstyring: | - |
| Spænding - Forsyning: | 4.5 V ~ 5.5 V |
| Leverandør Device Package: | 40-DIP |
| Serie: | - |
| protokol: | - |
| Emballage: | Tube |
| Pakke / tilfælde: | 40-DIP (0.600", 15.24mm) |
| Antal kanaler: | 8 |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | HD3-6402R-9Z |
| Funktioner: | - |
| FIFO s: | - |
| Beskrivelse: | IC UART CMOS 5V 2MHZ 40-DIP |
| Datahastighed (Max): | - |
| Email: | [email protected] |
Relaterede dele til HD3-6402R-9Z
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
SC16C554BIB64,128 | NXP USA Inc. | IC UART QUAD 64LQFP | Forespørgsel |
 |
XR16M770IL24-F | Exar Corporation | IC UART FIFO 64B 24QFN | Forespørgsel |
 |
HD3-6408-9Z | Intersil | IC ASMA ADT CMOS 1.25MHZ 24DIP | Forespørgsel |
 |
XR16C2852IJ-F | Exar Corporation | IC UART FIFO 128B 44PLCC | Forespørgsel |
 |
HD3-4702-9Z | Intersil | IC BIT RATE GEN CMOS 16DIP | Forespørgsel |
 |
HD3-6409-9Z | Intersil | IC ENCODER-DECODER CMOS 20DIP | Forespørgsel |
 |
SCC2692AE1B44,551 | NXP USA Inc. | IC UART DUAL W/FIFO 44QFP | Forespørgsel |
 |
XR16V2651IM-F | Exar Corporation | IC UART FIFO 32B DUAL 48TQFP | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers