Købe HFB095052-100 med BYCHPS
Køb med garanti
HFB095052-100
- Varenummer:
- HFB095052-100
- Beskrivelse:
- FERRITE CORE HINGED
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 13103 Pieces
Introduktion
BYCHIPS er strømforsyningsdistributøren for HFB095052-100, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til HFB095052-100 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Type: | Round |
|---|---|
| Serie: | HF |
| Vurderinger: | - |
| Ydermål: | - |
| Monteringstype: | Free Hanging |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Materiale: | HF |
| Fabrikantens standard ledetid: | 10 Weeks |
| Producentens varenummer: | HFB095052-100 |
| Længde: | - |
| Indvendig Dimension: | - |
| Impedans @ Frekvens: | - |
| Udvidet beskrivelse: | Hinged (Snap On) Free Hanging Ferrite Core |
| Design: | Hinged (Snap On) |
| Beskrivelse: | FERRITE CORE HINGED |
| Email: | [email protected] |
Relaterede dele til HFB095052-100
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
HFB095051-100 | Laird-Signal Integrity Products | FERRITE CORE 64 OHM SOLID 5.08MM | Forespørgsel |
 |
74278081 | Wurth Electronics Inc. | FERRITE CORE 19 OHM SOLID | Forespørgsel |
 |
ESD-FPL-21-8 | KEMET | FERRITE CORE SOLID 17MM X 0.8MM | Forespørgsel |
 |
HFB095051-200 | Laird-Signal Integrity Products | FERRITE CORE 120 OHM SOLID | Forespørgsel |
 |
28B0268-000 | Laird-Signal Integrity Products | FERRITE CORE 138 OHM SOLID | Forespørgsel |
 |
KR16TT191010 | Panasonic - DTG | FERRITE CORE 80 OHM SOLID 10MM | Forespørgsel |
 |
CF1-26*13*28.5 | API Delevan Inc. | FERRITE CORE 235 OHM SOLID 13MM | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog