Købe HFB123049-300 med BYCHPS
Køb med garanti
HFB123049-300
- Varenummer:
- HFB123049-300
- Beskrivelse:
- FERRITE CORE 258 OHM SOLID
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 13401 Pieces
Introduktion
BYCHIPS er strømforsyningsdistributøren for HFB123049-300, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til HFB123049-300 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Type: | Round |
|---|---|
| Serie: | HF |
| Vurderinger: | - |
| Ydermål: | 0.485" Dia (12.32mm) |
| Andre navne: | 240-2270 HFB123049300 |
| Monteringstype: | Free Hanging |
| Materiale: | HF |
| Fabrikantens standard ledetid: | 9 Weeks |
| Producentens varenummer: | HFB123049-300 |
| Længde: | 1.000" (25.40mm) |
| Indvendig Dimension: | 0.192" Dia (4.88mm) |
| Impedans @ Frekvens: | 258 Ohm @ 300MHz |
| Udvidet beskrivelse: | Solid Free Hanging Ferrite Core 258 Ohm @ 300MHz ID 0.192" Dia (4.88mm) OD 0.485" Dia (12.32mm) Length 1.000" (25.40mm) |
| Design: | Solid |
| Beskrivelse: | FERRITE CORE 258 OHM SOLID |
| Email: | [email protected] |
Relaterede dele til HFB123049-300
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
HFB123049-000 | Laird-Signal Integrity Products | FERRITE CORE 50 OHM SOLID 4.88MM | Forespørgsel |
 |
HFB123049-100 | Laird-Signal Integrity Products | FERRITE CORE 97 OHM SOLID 4.88MM | Forespørgsel |
 |
28R1518-000 | Laird-Signal Integrity Products | FERRITE CORE 235 OHM SOLID | Forespørgsel |
 |
74270020 | Wurth Electronics Inc. | FERRITE CORE 108 OHM SOLID 2.4MM | Forespørgsel |
 |
FSRB041020RNB00B | Murata Electronics North America | FERRITE CORE 267 OHM SOLID 1MM | Forespørgsel |
 |
HFB143064-100 | Laird-Signal Integrity Products | FERRITE CORE 85 OHM SOLID 6.35MM | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog