Købe HFB152034-000 med BYCHPS
Køb med garanti
HFB152034-000
- Varenummer:
- HFB152034-000
- Beskrivelse:
- FERRITE CORE 165 OHM SOLID
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 12661 Pieces
Introduktion
BYCHIPS er strømforsyningsdistributøren for HFB152034-000, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til HFB152034-000 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Type: | Round |
|---|---|
| Serie: | HF |
| Vurderinger: | - |
| Ydermål: | 0.600" Dia (15.24mm) |
| Andre navne: | 240-2151 HFB152034000 |
| Monteringstype: | Free Hanging |
| Materiale: | HF |
| Fabrikantens standard ledetid: | 10 Weeks |
| Producentens varenummer: | HFB152034-000 |
| Længde: | 0.394" (10.00mm) |
| Indvendig Dimension: | 0.133" Dia (3.38mm) |
| Impedans @ Frekvens: | 165 Ohm @ 300MHz |
| Udvidet beskrivelse: | Solid Free Hanging Ferrite Core 165 Ohm @ 300MHz ID 0.133" Dia (3.38mm) OD 0.600" Dia (15.24mm) Length 0.394" (10.00mm) |
| Design: | Solid |
| Beskrivelse: | FERRITE CORE 165 OHM SOLID |
| Email: | [email protected] |
Relaterede dele til HFB152034-000
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
HFB159079-100 | Laird-Signal Integrity Products | FERRITE CORE 235 OHM SOLID | Forespørgsel |
 |
HFB150070-200 | Laird-Signal Integrity Products | FERRITE CORE 242 OHM SOLID | Forespørgsel |
 |
FB43-226 | Bourns Inc. | FERRITE CORE SOLID 1.52MM | Forespørgsel |
 |
HFB157070-000 | Laird-Signal Integrity Products | FERRITE CORE 170 OHM SOLID | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers