Købe HHXB500ARA220MF61G med BYCHPS
Køb med garanti
HHXB500ARA220MF61G
- Varenummer:
- HHXB500ARA220MF61G
- Fabrikant:
- Nippon Chemi-Con
- Beskrivelse:
- CAP ALUM POLY HYB 22UF 50V SMD
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 12316 Pieces
Introduktion
BYCHIPS er strømforsyningsdistributøren for HHXB500ARA220MF61G, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til HHXB500ARA220MF61G via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsbedømmelse: | 50V |
|---|---|
| Type: | Hybrid |
| Tolerance: | ±20% |
| Overflade Mount Land Størrelse: | 0.260" L x 0.260" W (6.60mm x 6.60mm) |
| Størrelse / Dimension: | 0.248" Dia (6.30mm) |
| Serie: | Automotive, AEC-Q200, HXB |
| Ripple Current - Lavfrekvens: | - |
| Ripple Current - High Frequency: | 1.1A @ 100kHz |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | Radial, Can - SMD |
| Andre navne: | 565-4188-2 HHXB500ARA220MF61G-ND |
| Driftstemperatur: | -55°C ~ 105°C |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 15 Weeks |
| Producentens varenummer: | HHXB500ARA220MF61G |
| Levetid @ Temp.: | 5000 Hrs @ 105°C |
| Blyafstand: | - |
| Impedans: | - |
| Højde - Siddende (Max): | 0.240" (6.10mm) |
| Udvidet beskrivelse: | 22µF ±20% 50V Aluminum Polymer Capacitor Radial, Can - SMD 80 mOhm 5000 Hrs @ 105°C |
| ESR (Equivalent Series Resistance): | 80 mOhm |
| Beskrivelse: | CAP ALUM POLY HYB 22UF 50V SMD |
| kapacitans: | 22µF |
| Applikationer: | Automotive |
| Email: | [email protected] |
Relaterede dele til HHXB500ARA220MF61G
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers