Købe HMB1130K01M med BYCHPS
Køb med garanti
HMB1130K01M
- Varenummer:
- HMB1130K01M
- Beskrivelse:
- RELAY GEN PURPOSE DPDT 2A 26.5V
- Blyfri Status / RoHS Status:
- Indeholder bly / RoHS ikke-kompatibel
- Tilgængelig mængde:
- 15614 Pieces
- Datablad:
- HMB1130K01M.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for HMB1130K01M, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til HMB1130K01M via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Tænd for spænding (maks.): | 15 VDC |
|---|---|
| Sluk spænding (Min): | 1.5 VDC |
| Afslutningsstil: | Solder Hook |
| Skiftespænding: | 28VDC - Nom |
| Serie: | Military, MIL-R-39016/22, HMB, CII |
| Udgivelsestid: | 5ms |
| Relæ Type: | General Purpose |
| Emballage: | Bulk |
| Andre navne: | 1122-1136 1122-1136-MIL 1617038-6 A101706 A101706-ND HMB1130K01M-ND M39016/22-004M |
| Driftstemperatur: | -65°C ~ 125°C |
| Brug tid: | 5ms |
| Monteringstype: | Chassis Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 15 Weeks |
| Producentens varenummer: | HMB1130K01M |
| Funktioner: | Sealed - Hermetically |
| Udvidet beskrivelse: | General Purpose Relay DPDT (2 Form C) Chassis Mount |
| Beskrivelse: | RELAY GEN PURPOSE DPDT 2A 26.5V |
| Kontakt Rating (Aktuel): | 2A |
| Kontaktmateriale: | - |
| Kontaktformular: | DPDT (2 Form C) |
| Spole spænding: | 26.5VDC |
| Spole type: | Non Latching |
| Coil Resistance: | 700 Ohms |
| Coil Power: | 1 W |
| Coil Current: | 37.86mA |
| Email: | [email protected] |
Relaterede dele til HMB1130K01M
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers