Købe HMK325B7225KM-P med BYCHPS
Køb med garanti
HMK325B7225KM-P
- Varenummer:
- HMK325B7225KM-P
- Fabrikant:
- Taiyo Yuden
- Beskrivelse:
- CAP ,MIDHIGH VOL,1210,100V,X7R,2
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 16703 Pieces
Introduktion
BYCHIPS er strømforsyningsdistributøren for HMK325B7225KM-P, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til HMK325B7225KM-P via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Serie: | * |
|---|---|
| Andre navne: | 587-5395-2 CG HMK325 B7225KM-P |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 4 Weeks |
| Producentens varenummer: | HMK325B7225KM-P |
| Udvidet beskrivelse: | Ceramic Capacitor |
| Beskrivelse: | CAP ,MIDHIGH VOL,1210,100V,X7R,2 |
| Email: | [email protected] |
Relaterede dele til HMK325B7225KM-P
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
HMK325B7225MN-T | Taiyo Yuden | CAP CER 2.2UF 100V X7R 1210 | Forespørgsel |
|
HMK325B7224KN-T | Taiyo Yuden | CAP CER 0.22UF 100V X7R 1210 | Forespørgsel |
|
HMK325B7225MMHP | Taiyo Yuden | CAP CER 2.2UF 100V X7R 1210 | Forespørgsel |
|
HMK325B7225MM-P | Taiyo Yuden | CAP CER 2.2UF 100V X7R 1210 | Forespørgsel |
|
HMK325B7225KMHT | Taiyo Yuden | CAP CER 2.2UF 100V X7R 1210 | Forespørgsel |
|
HMK325B7225KN-T | Taiyo Yuden | CAP CER 2.2UF 100V X7R 1210 | Forespørgsel |
 |
HMK325B7225KMHP | Taiyo Yuden | CAP ,MIDHIGH VOL,1210,100V,X7R,2 | Forespørgsel |
|
HMK325B7225KN-L | Taiyo Yuden | CAP CER 2.2UF 100V X7R 1210 | Forespørgsel |
|
HMK325B7225KM-T | Taiyo Yuden | CAP CER 2.2UF 100V X7R 1210 | Forespørgsel |
|
HMK325B7225MM-T | Taiyo Yuden | CAP CER 2.2UF 100V X7R 1210 | Forespørgsel |
|
HMK325B7224MN-T | Taiyo Yuden | CAP CER 0.22UF 100V X7R 1210 | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers