Købe HS301 med BYCHPS
Køb med garanti
HS301
- Varenummer:
- HS301
- Fabrikant:
- Crydom
- Beskrivelse:
- HEATSINK SSR 3.0DEG C/W PNL MNT
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 15243 Pieces
- Datablad:
- 1.HS301.pdf2.HS301.pdf3.HS301.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for HS301, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til HS301 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| specifikationer: | 3.0° C/W |
|---|---|
| Serie: | HS |
| Andre navne: | CC1693 |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 6 Weeks |
| Producentens varenummer: | HS301 |
| Til brug med / relaterede produkter: | Multiple Series |
| Udvidet beskrivelse: | Heat Sink Multiple Series |
| Beskrivelse: | HEATSINK SSR 3.0DEG C/W PNL MNT |
| Farve: | - |
| Tilbehørstype: | Heat Sink |
| Email: | [email protected] |
Relaterede dele til HS301
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
HS301DR | Crydom Co. | HEATSINK SSR 3.0DEG C/W DIN MNT | Forespørgsel |
 |
HS301DR-D2425 | Crydom Co. | RELAY SSR SPST 24A W/HEATSINK ZC | Forespørgsel |
 |
4-1393209-2 | TE Connectivity Potter & Brumfield Relays | BLK DUST COVER FOR T90N SERIES | Forespørgsel |
 |
4-1416100-0 | TE Connectivity Potter & Brumfield Relays | ST37040 (CONSIST 100 MARKING TAG | Forespørgsel |
 |
HS301DR-SMR2425-6 | Crydom Co. | SSR/HS ASSY | Forespørgsel |
 |
G32A-A20-VD DC5-24 | Omron Automation and Safety | REPLACEMENT POWER CARTRIDGE 20A | Forespørgsel |
|
HS301DR-84137010 | Crydom Co. | SSR / HS ASSY | Forespørgsel |
|
HS301-D2490-B | Crydom Co. | SSR/HS ASSY | Forespørgsel |
|
HS301DR-HD6025 | Crydom Co. | RELAY SSR SPST 24A W/HEATSINK ZC | Forespørgsel |
|
HS301-D4850 | Crydom Co. | SSR/HS ASSY | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers