Købe HSTL16918DGG,112 med BYCHPS
Køb med garanti
HSTL16918DGG,112
- Varenummer:
- HSTL16918DGG,112
- Fabrikant:
- NXP Semiconductors / Freescale
- Beskrivelse:
- IC MEMORY ADDRESS LATCH 48TSSOP
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 19637 Pieces
- Datablad:
- HSTL16918DGG,112.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for HSTL16918DGG,112, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til HSTL16918DGG,112 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Forsyning: | 3.15 V ~ 3.45 V |
|---|---|
| Leverandør Device Package: | 48-TSSOP |
| Serie: | HSTL |
| Emballage: | Tube |
| Pakke / tilfælde: | 48-TFSOP (0.240", 6.10mm Width) |
| Output Type: | Tri-State |
| Andre navne: | 935270253112 |
| Driftstemperatur: | 0°C ~ 70°C |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | HSTL16918DGG,112 |
| Logik Type: | D-Type Latch |
| Uafhængige kredsløb: | 1 |
| Udvidet beskrivelse: | D-Type Latch Channel 9:18 IC Tri-State 48-TSSOP |
| Beskrivelse: | IC MEMORY ADDRESS LATCH 48TSSOP |
| Forsinkelsestid - Forplantning: | 3.4ns |
| Nuværende - Output High, Low: | 24mA, 24mA |
| Kredsløb: | 9:18 |
| Email: | [email protected] |
Relaterede dele til HSTL16918DGG,112
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
HSTL16918DGG,512 | NXP USA Inc. | IC MEMORY ADDRESS LATCH 48TSSOP | Forespørgsel |
|
HSTL16918DGG,118 | NXP USA Inc. | IC MEMORY ADDRESS LATCH 48TSSOP | Forespørgsel |
|
HSTL16918DGG,518 | NXP USA Inc. | IC MEMORY ADDRESS LATCH 48TSSOP | Forespørgsel |
|
HSTL16919DGG,112 | NXP USA Inc. | IC MEMORY ADDRESS LATCH 48TSSOP | Forespørgsel |
|
HSTL16919DGG,118 | NXP USA Inc. | IC MEMORY ADDRESS LATCH 48TSSOP | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers