Købe HUF76445S3ST med BYCHPS
Køb med garanti
HUF76445S3ST
- Varenummer:
- HUF76445S3ST
- Fabrikant:
- Fairchild/ON Semiconductor
- Beskrivelse:
- MOSFET N-CH 60V 75A D2PAK
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 17432 Pieces
- Datablad:
- HUF76445S3ST.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for HUF76445S3ST, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til HUF76445S3ST via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Vgs (th) (Max) @ Id: | 3V @ 250µA |
|---|---|
| Teknologi: | MOSFET (Metal Oxide) |
| Leverandør Device Package: | D²PAK (TO-263AB) |
| Serie: | UltraFET™ |
| Rds On (Max) @ Id, Vgs: | 6.5 mOhm @ 75A, 10V |
| Power Dissipation (Max): | 310W (Tc) |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | TO-263-3, D²Pak (2 Leads + Tab), TO-263AB |
| Driftstemperatur: | -55°C ~ 175°C (TJ) |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | HUF76445S3ST |
| Inputkapacitans (Ciss) (Max) @ Vds: | 4965pF @ 25V |
| Gate Charge (Qg) (Max) @ Vgs: | 150nC @ 10V |
| FET Type: | N-Channel |
| FET-funktion: | - |
| Udvidet beskrivelse: | N-Channel 60V 75A (Tc) 310W (Tc) Surface Mount D²PAK (TO-263AB) |
| Afløb til Source Voltage (VDSS): | 60V |
| Beskrivelse: | MOSFET N-CH 60V 75A D2PAK |
| Strøm - Kontinuerlig afløb (Id) @ 25 ° C: | 75A (Tc) |
| Email: | [email protected] |
Relaterede dele til HUF76445S3ST
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog