Købe HV0830-2R7605-R med BYCHPS
Køb med garanti
HV0830-2R7605-R
- Varenummer:
- HV0830-2R7605-R
- Fabrikant:
- Bussmann (Eaton)
- Beskrivelse:
- CAP 6F -10% +30% 2.7V T/H
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 16239 Pieces
- Datablad:
- HV0830-2R7605-R.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for HV0830-2R7605-R, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til HV0830-2R7605-R via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering: | 2.7V |
|---|---|
| Tolerance: | -10%, +30% |
| Afslutning: | Through Hole |
| Størrelse / Dimension: | 0.315" Dia (8.00mm) |
| Serie: | PowerStor HV |
| Emballage: | Bulk |
| Pakke / tilfælde: | Radial, Can |
| Andre navne: | 283-4204 HV08302R7605R |
| Driftstemperatur: | -40°C ~ 65°C |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 15 Weeks |
| Producentens varenummer: | HV0830-2R7605-R |
| Levetid @ Temp.: | 1000 Hrs @ 65°C |
| Blyafstand: | 0.138" (3.50mm) |
| Højde - Siddende (Max): | 1.220" (31.00mm) |
| Udvidet beskrivelse: | 6F -10%, +30%(EDLC) Supercapacitor 2.7V Radial, Can 40 mOhm @ 100Hz 1000 Hrs @ 65°C |
| ESR (Equivalent Series Resistance): | 40 mOhm @ 100Hz |
| Beskrivelse: | CAP 6F -10% +30% 2.7V T/H |
| kapacitans: | 6F |
| Email: | [email protected] |
Relaterede dele til HV0830-2R7605-R
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
MAL219612105E3 | Vishay BC Components | CAP 1F -20% +80 5.5V THRU HOLE | Forespørgsel |
 |
PC10 | Maxwell Technologies Inc. | CAP 10F 2.5V THROUGH HOLE | Forespørgsel |
|
MAL219691253E3 | Vishay BC Components | CAP ALUM 15F 4.2V SMD | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers