Købe IDT74SSTUBF32865ABK med BYCHPS
Køb med garanti
IDT74SSTUBF32865ABK
- Varenummer:
- IDT74SSTUBF32865ABK
- Fabrikant:
- IDT (Integrated Device Technology)
- Beskrivelse:
- IC BUFFER 28BIT 1:2 REG 160-BGA
- Blyfri Status / RoHS Status:
- Indeholder bly / RoHS ikke-kompatibel
- Tilgængelig mængde:
- 15350 Pieces
- Datablad:
- IDT74SSTUBF32865ABK.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for IDT74SSTUBF32865ABK, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til IDT74SSTUBF32865ABK via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Forsyningsspænding: | 1.7 V ~ 1.9 V |
|---|---|
| Leverandør Device Package: | 160-CABGA (9x13) |
| Serie: | - |
| Emballage: | Tray |
| Pakke / tilfælde: | 160-LFBGA |
| Andre navne: | 74SSTUBF32865ABK |
| Driftstemperatur: | 0°C ~ 70°C |
| Antal bitter: | 28 |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 3 (168 Hours) |
| Producentens varenummer: | IDT74SSTUBF32865ABK |
| Logik Type: | 1:2 Registered Buffer with Parity |
| Udvidet beskrivelse: | 1:2 Registered Buffer with Parity IC 160-CABGA (9x13) |
| Beskrivelse: | IC BUFFER 28BIT 1:2 REG 160-BGA |
| Email: | [email protected] |
Relaterede dele til IDT74SSTUBF32865ABK
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers