Købe IDT79RC32T333-133DH med BYCHPS
Køb med garanti
IDT79RC32T333-133DH
- Varenummer:
- IDT79RC32T333-133DH
- Fabrikant:
- IDT (Integrated Device Technology)
- Beskrivelse:
- IC MPU INTERPRISE 133MHZ 208QFP
- Blyfri Status / RoHS Status:
- Indeholder bly / RoHS ikke-kompatibel
- Tilgængelig mængde:
- 17034 Pieces
- Datablad:
- IDT79RC32T333-133DH.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for IDT79RC32T333-133DH, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til IDT79RC32T333-133DH via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - I / O: | 2.5V, 3.3V |
|---|---|
| USB: | - |
| Leverandør Device Package: | 208-PQFP (28x28) |
| Fart: | 133MHz |
| Serie: | Interprise™ |
| Sikkerhedsfunktioner: | - |
| SATA: | - |
| RAM-controllere: | SDRAM |
| Emballage: | Tray |
| Pakke / tilfælde: | 208-BFQFP |
| Andre navne: | 79RC32T333-133DH |
| Driftstemperatur: | 0°C ~ 70°C (TA) |
| Antal kerne / busbredde: | 1 Core, 32-Bit |
| Fugtfølsomhedsniveau (MSL): | 3 (168 Hours) |
| Producentens varenummer: | IDT79RC32T333-133DH |
| Grafik acceleration: | No |
| Udvidet beskrivelse: | MIPS-II Microprocessor IC Interprise™ 1 Core, 32-Bit 133MHz 208-PQFP (28x28) |
| Ethernet: | - |
| Display & Interface Controllers: | - |
| Beskrivelse: | IC MPU INTERPRISE 133MHZ 208QFP |
| Core Processor: | MIPS-II |
| Co-processorer / DSP: | - |
| Yderligere grænseflader: | PCI, SPI, UART |
| Email: | [email protected] |
Relaterede dele til IDT79RC32T333-133DH
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog