Købe IGW30N60TPXKSA1 med BYCHPS
Køb med garanti
IGW30N60TPXKSA1
- Varenummer:
- IGW30N60TPXKSA1
- Beskrivelse:
- IGBT 600V 53A 200W TO247
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 17791 Pieces
- Datablad:
- IGW30N60TPXKSA1.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for IGW30N60TPXKSA1, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til IGW30N60TPXKSA1 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Samler Emitter Opdeling (Max): | 600V |
|---|---|
| Vce (på) (Max) @ Vge, Ic: | 1.8V @ 15V, 30A |
| Testtilstand: | 400V, 30A, 10.5 Ohm, 15V |
| Td (tænd / sluk) @ 25 ° C: | 15ns/179ns |
| Skifte energi: | 710µJ (on), 420µJ (off) |
| Leverandør Device Package: | PG-TO247-3 |
| Serie: | TrenchStop™ |
| Strøm - Max: | 200W |
| Emballage: | Tube |
| Pakke / tilfælde: | TO-247-3 |
| Andre navne: | SP001379674 |
| Driftstemperatur: | -40°C ~ 175°C (TJ) |
| Monteringstype: | Through Hole |
| Fabrikantens standard ledetid: | 14 Weeks |
| Producentens varenummer: | IGW30N60TPXKSA1 |
| Input Type: | Standard |
| IGBT Type: | Trench Field Stop |
| Gate Charge: | 130nC |
| Udvidet beskrivelse: | IGBT Trench Field Stop 600V 53A 200W Through Hole PG-TO247-3 |
| Beskrivelse: | IGBT 600V 53A 200W TO247 |
| Nuværende - Collector Pulsed (Icm): | 90A |
| Nuværende - Samler (Ic) (Max): | 53A |
| Email: | [email protected] |
Relaterede dele til IGW30N60TPXKSA1
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog