Købe IMB5AT108 med BYCHPS
Køb med garanti
IMB5AT108
- Varenummer:
- IMB5AT108
- Fabrikant:
- LAPIS Semiconductor
- Beskrivelse:
- TRANS PREBIAS 2PNP 50V SC74
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 15399 Pieces
- Datablad:
- IMB5AT108.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for IMB5AT108, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til IMB5AT108 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Samler Emitter Opdeling (Max): | 50V |
|---|---|
| Vce Mætning (Max) @ Ib, Ic: | - |
| Transistor Type: | 2 PNP - Pre-Biased (Dual) |
| Leverandør Device Package: | SMT6 |
| Serie: | - |
| Modstand - Emitterbase (R2) (Ohm): | 22k |
| Modstand - Base (R1) (Ohms): | 22k |
| Strøm - Max: | - |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | SC-74, SOT-457 |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | IMB5AT108 |
| Frekvens - Overgang: | - |
| Udvidet beskrivelse: | Pre-Biased Bipolar Transistor (BJT) 2 PNP - Pre-Biased (Dual) 50V 30mA Surface Mount SMT6 |
| Beskrivelse: | TRANS PREBIAS 2PNP 50V SC74 |
| DC Current Gain (hFE) (Min) @ Ic, Vce: | 56 @ 5mA, 5V |
| Nuværende - Collector Cutoff (Max): | - |
| Nuværende - Samler (Ic) (Max): | 30mA |
| Email: | [email protected] |
Relaterede dele til IMB5AT108
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
BCR 133S H6444 | Infineon Technologies | TRANS 2NPN PREBIAS 0.25W SOT363 | Forespørgsel |
 |
RN1706JE(TE85L,F) | Toshiba Semiconductor and Storage | TRANS 2NPN PREBIAS 0.1W ESV | Forespørgsel |
 |
UMH9NTN | Rohm Semiconductor | TRANS 2NPN PREBIAS 0.15W UMT6 | Forespørgsel |
 |
MUN5216DW1T1 | ON Semiconductor | TRANS 2NPN PREBIAS 0.25W SOT363 | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers