Købe IRGB30B60K med BYCHPS
Køb med garanti
IRGB30B60K
- Varenummer:
- IRGB30B60K
- Beskrivelse:
- IGBT 600V 78A 370W TO220AB
- Blyfri Status / RoHS Status:
- Indeholder bly / RoHS ikke-kompatibel
- Tilgængelig mængde:
- 19429 Pieces
- Datablad:
- IRGB30B60K.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for IRGB30B60K, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til IRGB30B60K via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Samler Emitter Opdeling (Max): | 600V |
|---|---|
| Vce (på) (Max) @ Vge, Ic: | 2.35V @ 15V, 30A |
| Testtilstand: | 400V, 30A, 10 Ohm, 15V |
| Td (tænd / sluk) @ 25 ° C: | 46ns/185ns |
| Skifte energi: | 350µJ (on), 825µJ (off) |
| Leverandør Device Package: | TO-220AB |
| Serie: | - |
| Strøm - Max: | 370W |
| Emballage: | Tube |
| Pakke / tilfælde: | TO-220-3 |
| Andre navne: | *IRGB30B60K |
| Driftstemperatur: | -55°C ~ 175°C (TJ) |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | IRGB30B60K |
| Input Type: | Standard |
| IGBT Type: | NPT |
| Gate Charge: | 102nC |
| Udvidet beskrivelse: | IGBT NPT 600V 78A 370W Through Hole TO-220AB |
| Beskrivelse: | IGBT 600V 78A 370W TO220AB |
| Nuværende - Collector Pulsed (Icm): | 120A |
| Nuværende - Samler (Ic) (Max): | 78A |
| Email: | [email protected] |
Relaterede dele til IRGB30B60K
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
IRGB30B60KPBF | Infineon Technologies | IGBT 600V 78A 370W TO220AB | Forespørgsel |
 |
IXBT42N170A | IXYS | IGBT 1700V 42A 357W TO268 | Forespørgsel |
 |
FGB3040G2_F085 | Fairchild/ON Semiconductor | IGBT 400V 41A TO263 | Forespørgsel |
 |
IXSK35N120BD1 | IXYS | IGBT 1200V 70A 300W TO264 | Forespørgsel |
 |
IHW20N135R5XKSA1 | Infineon Technologies | IGBT 1350V 40A 288W TO247 | Forespørgsel |
 |
IRGP4266-EPBF | Infineon Technologies | IGBT 650V 140A 450W TO247AD | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers