Købe IRLSL4030PBF med BYCHPS
Køb med garanti
IRLSL4030PBF
- Varenummer:
- IRLSL4030PBF
- Beskrivelse:
- MOSFET N-CH 100V 180A TO-262
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 16356 Pieces
- Datablad:
- IRLSL4030PBF.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for IRLSL4030PBF, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til IRLSL4030PBF via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Vgs (th) (Max) @ Id: | 2.5V @ 250µA |
|---|---|
| Vgs (Max): | ±16V |
| Teknologi: | MOSFET (Metal Oxide) |
| Leverandør Device Package: | TO-262 |
| Serie: | HEXFET® |
| Rds On (Max) @ Id, Vgs: | 4.3 mOhm @ 110A, 10V |
| Power Dissipation (Max): | 370W (Tc) |
| Emballage: | Tube |
| Pakke / tilfælde: | TO-262-3 Long Leads, I²Pak, TO-262AA |
| Andre navne: | SP001558626 |
| Driftstemperatur: | -55°C ~ 175°C (TJ) |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 14 Weeks |
| Producentens varenummer: | IRLSL4030PBF |
| Inputkapacitans (Ciss) (Max) @ Vds: | 11360pF @ 50V |
| Gate Charge (Qg) (Max) @ Vgs: | 130nC @ 4.5V |
| FET Type: | N-Channel |
| FET-funktion: | - |
| Udvidet beskrivelse: | N-Channel 100V 180A (Tc) 370W (Tc) Through Hole TO-262 |
| Drevspænding (Maks. Rds On, Min Rds On): | 4.5V, 10V |
| Afløb til Source Voltage (VDSS): | 100V |
| Beskrivelse: | MOSFET N-CH 100V 180A TO-262 |
| Strøm - Kontinuerlig afløb (Id) @ 25 ° C: | 180A (Tc) |
| Email: | [email protected] |
Relaterede dele til IRLSL4030PBF
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers