Købe IRLU8729-701PBF med BYCHPS
Køb med garanti
IRLU8729-701PBF
- Varenummer:
- IRLU8729-701PBF
- Beskrivelse:
- MOSFET N-CH 30V 58A IPAK
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 19680 Pieces
- Datablad:
- IRLU8729-701PBF.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for IRLU8729-701PBF, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til IRLU8729-701PBF via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Vgs (th) (Max) @ Id: | 2.35V @ 25µA |
|---|---|
| Teknologi: | MOSFET (Metal Oxide) |
| Leverandør Device Package: | I-Pak |
| Serie: | HEXFET® |
| Rds On (Max) @ Id, Vgs: | 8.9 mOhm @ 25A, 10V |
| Power Dissipation (Max): | 55W (Tc) |
| Emballage: | Tube |
| Pakke / tilfælde: | TO-251-3 Short Leads, IPak, TO-251AA |
| Andre navne: | IRLU8729PBF IRLU8729PBF-ND SP001552984 |
| Driftstemperatur: | -55°C ~ 175°C (TJ) |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | IRLU8729-701PBF |
| Inputkapacitans (Ciss) (Max) @ Vds: | 1350pF @ 15V |
| Gate Charge (Qg) (Max) @ Vgs: | 16nC @ 4.5V |
| FET Type: | N-Channel |
| FET-funktion: | - |
| Udvidet beskrivelse: | N-Channel 30V 58A (Tc) 55W (Tc) Through Hole I-Pak |
| Afløb til Source Voltage (VDSS): | 30V |
| Beskrivelse: | MOSFET N-CH 30V 58A IPAK |
| Strøm - Kontinuerlig afløb (Id) @ 25 ° C: | 58A (Tc) |
| Email: | [email protected] |
Relaterede dele til IRLU8729-701PBF
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog