Købe ISL21007BFB825Z-TK med BYCHPS
Køb med garanti
ISL21007BFB825Z-TK
- Varenummer:
- ISL21007BFB825Z-TK
- Fabrikant:
- Intersil
- Beskrivelse:
- IC VREF SERIES 2.5V 8SOIC
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 13815 Pieces
- Datablad:
- ISL21007BFB825Z-TK.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for ISL21007BFB825Z-TK, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til ISL21007BFB825Z-TK via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Output (Min / Fast): | 2.5V |
|---|---|
| Spænding - Udgang (Max): | - |
| Spænding - Indgang: | 2.7 V ~ 5.5 V |
| Tolerance: | ±0.04% |
| Temperaturkoefficient: | 3ppm/°C |
| Leverandør Device Package: | 8-SOIC |
| Serie: | FGA™ |
| Reference Type: | Series |
| Emballage: | Original-Reel® |
| Pakke / tilfælde: | 8-SOIC (0.154", 3.90mm Width) |
| Output Type: | Fixed |
| Andre navne: | ISL21007BFB825Z-TKDKR |
| Driftstemperatur: | -40°C ~ 125°C (TA) |
| Støj - 10Hz til 10kHz: | - |
| Støj - 0,1 Hz til 10 Hz: | 4.5µVp-p |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | ISL21007BFB825Z-TK |
| Udvidet beskrivelse: | Series Voltage Reference IC ±0.04% 5mA 8-SOIC |
| Beskrivelse: | IC VREF SERIES 2.5V 8SOIC |
| Nuværende - Forsyning: | 150µA |
| Nuværende - Output: | 5mA |
| Nuværende - Katode: | - |
| Email: | [email protected] |
Relaterede dele til ISL21007BFB825Z-TK
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog