Købe IXA20PG1200DHGLB med BYCHPS
Køb med garanti
IXA20PG1200DHGLB
- Varenummer:
- IXA20PG1200DHGLB
- Fabrikant:
- IXYS Corporation
- Beskrivelse:
- IGBT MODULE 1200V 105A SMPD
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 16816 Pieces
- Datablad:
- IXA20PG1200DHGLB.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for IXA20PG1200DHGLB, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til IXA20PG1200DHGLB via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Samler Emitter Opdeling (Max): | 1200V |
|---|---|
| Vce (på) (Max) @ Vge, Ic: | 2.1V @ 15V, 15A |
| Leverandør Device Package: | ISOPLUS-SMPD™.B |
| Serie: | - |
| Strøm - Max: | 130W |
| Pakke / tilfælde: | 9-SMD Module |
| Driftstemperatur: | -55°C ~ 150°C (TJ) |
| NTC termistor: | No |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | IXA20PG1200DHGLB |
| Inputkapacitans (Cies) @ Vce: | - |
| Input: | Standard |
| IGBT Type: | PT |
| Udvidet beskrivelse: | IGBT Array PT Half Bridge 1200V 32A 130W Surface Mount ISOPLUS-SMPD™.B |
| Beskrivelse: | IGBT MODULE 1200V 105A SMPD |
| Nuværende - Collector Cutoff (Max): | 125µA |
| Nuværende - Samler (Ic) (Max): | 32A |
| Konfiguration: | Half Bridge |
| Email: | [email protected] |
Relaterede dele til IXA20PG1200DHGLB
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
IXA20PG1200DHGLB-TRR | IXYS | IGBT MODULE 1200V 105A SMPD | Forespørgsel |
|
IXA20RG1200DHGLB | IXYS | IGBT 1200V 32A 125W SMPD | Forespørgsel |
 |
IXA20I1200PB | IXYS | IGBT 1200V 33A 130W TO220 | Forespørgsel |
 |
IXA20IF1200HB | IXYS | IGBT 1200V 38A 165W TO247 | Forespørgsel |
|
IXA20RG1200DHGLB-TRR | IXYS | IGBT 1200V 32A 125W SMPD | Forespørgsel |
 |
FII40-06D | IXYS | IGBT 600V 40A I-PACK | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers