Købe IXSN80N60AU1 med BYCHPS
Køb med garanti
IXSN80N60AU1
- Varenummer:
- IXSN80N60AU1
- Fabrikant:
- IXYS Corporation
- Beskrivelse:
- IGBT 100A 600V SOT-227B
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 17396 Pieces
- Datablad:
- IXSN80N60AU1.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for IXSN80N60AU1, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til IXSN80N60AU1 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Samler Emitter Opdeling (Max): | 600V |
|---|---|
| Vce (på) (Max) @ Vge, Ic: | 3V @ 15V, 80A |
| Leverandør Device Package: | SOT-227B |
| Serie: | - |
| Strøm - Max: | 500W |
| Pakke / tilfælde: | SOT-227-4, miniBLOC |
| Driftstemperatur: | -55°C ~ 150°C (TJ) |
| NTC termistor: | No |
| Monteringstype: | Chassis Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | IXSN80N60AU1 |
| Inputkapacitans (Cies) @ Vce: | 8.5nF @ 25V |
| Input: | Standard |
| IGBT Type: | - |
| Udvidet beskrivelse: | IGBT Module Single 600V 160A 500W Chassis Mount SOT-227B |
| Beskrivelse: | IGBT 100A 600V SOT-227B |
| Nuværende - Collector Cutoff (Max): | 1mA |
| Nuværende - Samler (Ic) (Max): | 160A |
| Konfiguration: | Single |
| Email: | [email protected] |
Relaterede dele til IXSN80N60AU1
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
APT60GF120JRDQ3 | Microsemi Corporation | IGBT 1200V 149A 625W SOT227 | Forespørgsel |
 |
APTGT50DSK60T3G | Microsemi Corporation | IGBT MOD TRENCH DL BUCK CHOP SP3 | Forespørgsel |
 |
IXSN80N60BD1 | IXYS | IGBT 600V SCSOA SOT-227B | Forespørgsel |
|
APTGT35A120T1G | Microsemi Corporation | IGBT MOD TRENCH PHASE LEG SP1 | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers