Købe J1MAC-12XLS med BYCHPS
Køb med garanti
J1MAC-12XLS
- Varenummer:
- J1MAC-12XLS
- Beskrivelse:
- RELAY GEN PURPOSE SPDT 1A 12V
- Blyfri Status / RoHS Status:
- Indeholder bly / RoHS ikke-kompatibel
- Tilgængelig mængde:
- 15718 Pieces
- Datablad:
- J1MAC-12XLS.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for J1MAC-12XLS, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til J1MAC-12XLS via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Tænd for spænding (maks.): | 7 VDC |
|---|---|
| Sluk spænding (Min): | 0.63 VDC |
| Afslutningsstil: | PC Pin |
| Skiftespænding: | 28VDC - Nom |
| Serie: | Military, MIL-R-39016/7, 1MA, CII |
| Udgivelsestid: | 2ms |
| Relæ Type: | General Purpose |
| Emballage: | Bulk |
| Andre navne: | 1122-1048 1122-1048-MIL 1617118-1 A101605 A101605-ND J1MAC12XLS M39016/7-034L |
| Driftstemperatur: | -65°C ~ 125°C |
| Brug tid: | 2ms |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 12 Weeks |
| Producentens varenummer: | J1MAC-12XLS |
| Funktioner: | Sealed - Hermetically |
| Udvidet beskrivelse: | General Purpose Relay SPDT (1 Form C) Through Hole |
| Beskrivelse: | RELAY GEN PURPOSE SPDT 1A 12V |
| Kontakt Rating (Aktuel): | 1A |
| Kontaktmateriale: | - |
| Kontaktformular: | SPDT (1 Form C) |
| Spole spænding: | 12VDC |
| Spole type: | Non Latching |
| Coil Resistance: | 500 Ohms |
| Coil Power: | 288 mW |
| Coil Current: | 24mA |
| Email: | [email protected] |
Relaterede dele til J1MAC-12XLS
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers