Købe JDP2S08SC(TPL3) med BYCHPS
Køb med garanti
JDP2S08SC(TPL3)
- Varenummer:
- JDP2S08SC(TPL3)
- Fabrikant:
- Toshiba Semiconductor
- Beskrivelse:
- DIODE PIN 30V 50MA SC2
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 14393 Pieces
- Datablad:
- JDP2S08SC(TPL3).pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for JDP2S08SC(TPL3), vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til JDP2S08SC(TPL3) via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Peak Reverse (Max): | 30V |
|---|---|
| Leverandør Device Package: | SC2 |
| Serie: | - |
| Modstand @ Hvis, F: | 1.5 Ohm @ 10mA, 100MHz |
| Power Dissipation (Max): | - |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 2-SMD, No Lead |
| Andre navne: | JDP2S08SC(TPL3)TR JDP2S08SCTPL3 |
| Driftstemperatur: | 150°C (TJ) |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | JDP2S08SC(TPL3) |
| Udvidet beskrivelse: | RF Diode PIN - Single 30V 50mA SC2 |
| Diodetype: | PIN - Single |
| Beskrivelse: | DIODE PIN 30V 50MA SC2 |
| Nuværende - Maks: | 50mA |
| Kapacitans @ Vr, F: | 0.4pF @ 1V, 1MHz |
| Email: | [email protected] |
Relaterede dele til JDP2S08SC(TPL3)
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
SMP1371-087LF | Skyworks Solutions Inc. | DIODE PIN 35V 200MA 2QFN | Forespørgsel |
 |
JDP2S12CR(TE85L,Q | Toshiba Semiconductor and Storage | DIODE PIN 180V 1A S-FLAT | Forespørgsel |
 |
BAP50-03,115 | NXP USA Inc. | DIODE PIN GP 50V 50MA SOD-323 | Forespørgsel |
 |
JDP2S02AFS(TPL3) | Toshiba Semiconductor and Storage | DIODE PIN 30V 50MA FSC | Forespørgsel |
 |
JDP2S02ACT(TPL3) | Toshiba Semiconductor and Storage | DIODE PIN 30V 50MA CTS2 | Forespørgsel |
 |
MA4P7006F-1072T | M/A-Com Technology Solutions | DIODE PIN SMQ CERAMIC SI | Forespørgsel |
|
MA4P504-1072T | M/A-Com Technology Solutions | DIODE PIN SMQ CERAMIC SI | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers