Købe JUM0H184ACD med BYCHPS
Køb med garanti
JUM0H184ACD
- Varenummer:
- JUM0H184ACD
- Fabrikant:
- Nichicon
- Beskrivelse:
- CAP 0.18F 20% 5.5V THROUGH HOLE
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 13768 Pieces
- Datablad:
- JUM0H184ACD.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for JUM0H184ACD, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til JUM0H184ACD via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering: | 5.5V |
|---|---|
| Tolerance: | 0% , 40% |
| Afslutning: | Through Hole |
| Størrelse / Dimension: | 0.650" Dia (16.50mm) |
| Serie: | EVerCAP® JUM |
| Emballage: | Bulk |
| Pakke / tilfælde: | Radial, Can |
| Andre navne: | 493-13569 |
| Driftstemperatur: | -30°C ~ 85°C |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 18 Weeks |
| Producentens varenummer: | JUM0H184ACD |
| Levetid @ Temp.: | 1000 Hrs @ 70°C |
| Blyafstand: | 0.201" (5.10mm) |
| Højde - Siddende (Max): | 0.532" (13.50mm) |
| Udvidet beskrivelse: | 180mF 0% , 40%(EDLC) Supercapacitor 5.5V Radial, Can 2 Ohm 1000 Hrs @ 70°C |
| ESR (Equivalent Series Resistance): | 2 Ohm |
| Beskrivelse: | CAP 0.18F 20% 5.5V THROUGH HOLE |
| kapacitans: | 180mF |
| Email: | [email protected] |
Relaterede dele til JUM0H184ACD
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
EDLRF684B5R5C | Cornell Dubilier Electronics (CDE) | CAP 680MF -20% +80% 5.5V T/H | Forespørgsel |
 |
DBJ-5R5D104T | Elna America | CAP 100MF -20% +80% 5.5V T/H | Forespørgsel |
 |
B49410A2115Q000 | EPCOS (TDK) | CAP 110F -10% +30% 2.5V T/H | Forespørgsel |
 |
BMOD0500 P016 B02 | Maxwell Technologies Inc. | CAP 500F 16V CHASSIS MOUNT | Forespørgsel |
 |
DB-5R5D104T | Elna America | CAP 100MF -20% +80% 5.5V T/H | Forespørgsel |
 |
CPH3225A | Seiko Instruments | CAP 11MF 3.3V SURFACE MOUNT | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers