Købe KR50TA251512B1 med BYCHPS
Køb med garanti
KR50TA251512B1
- Varenummer:
- KR50TA251512B1
- Fabrikant:
- Panasonic
- Beskrivelse:
- FERRITE CORE 14 OHM CLAMP 13.5MM
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 16712 Pieces
- Datablad:
- KR50TA251512B1.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for KR50TA251512B1, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til KR50TA251512B1 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Type: | Round |
|---|---|
| Serie: | TA |
| Vurderinger: | - |
| Ydermål: | 1.043" Dia (26.50mm) |
| Andre navne: | P11400 |
| Monteringstype: | Chassis Mount |
| Materiale: | - |
| Producentens varenummer: | KR50TA251512B1 |
| Længde: | 0.551" (14.00mm) |
| Indvendig Dimension: | 0.531" Dia (13.50mm) |
| Impedans @ Frekvens: | 14 Ohm @ 10MHz |
| Udvidet beskrivelse: | Clamp Chassis Mount Ferrite Core 14 Ohm @ 10MHz ID 0.531" Dia (13.50mm) OD 1.043" Dia (26.50mm) Length 0.551" (14.00mm) |
| Design: | Clamp |
| Beskrivelse: | FERRITE CORE 14 OHM CLAMP 13.5MM |
| Email: | [email protected] |
Relaterede dele til KR50TA251512B1
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
74270090 | Wurth Electronics Inc. | FERRITE CORE 250 OHM SOLID 13MM | Forespørgsel |
 |
28S2001-1M0 | Laird-Signal Integrity Products | FERRITE CORE 150 OHM CLIP 2PCS=1 | Forespørgsel |
|
28S2001-000 | Laird-Signal Integrity Products | FERRITE CORE CLIP | Forespørgsel |
 |
AB5X4X3DY | Toshiba Semiconductor and Storage | FERRITE CORE SOLID | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers