Købe KRCBC261329B med BYCHPS
Køb med garanti
KRCBC261329B
- Varenummer:
- KRCBC261329B
- Fabrikant:
- Panasonic
- Beskrivelse:
- FERRITE CORE 170 OHM HINGED
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 14825 Pieces
- Datablad:
- KRCBC261329B.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for KRCBC261329B, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til KRCBC261329B via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Type: | Round |
|---|---|
| Serie: | KRCB |
| Vurderinger: | - |
| Ydermål: | 1.299" W x 1.240" H (33.00mm x 31.50mm) |
| Andre navne: | P11397 |
| Monteringstype: | Free Hanging |
| Materiale: | - |
| Producentens varenummer: | KRCBC261329B |
| Længde: | 1.339" (34.00mm) |
| Indvendig Dimension: | 0.504" Dia (12.80mm) |
| Impedans @ Frekvens: | 170 Ohm @ 100MHz |
| Udvidet beskrivelse: | Hinged (Snap On) Free Hanging Ferrite Core 170 Ohm @ 100MHz ID 0.504" Dia (12.80mm) OD 1.299" W x 1.240" H (33.00mm x 31.50mm) Length 1.339" (34.00mm) |
| Design: | Hinged (Snap On) |
| Beskrivelse: | FERRITE CORE 170 OHM HINGED |
| Email: | [email protected] |
Relaterede dele til KRCBC261329B
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
KRCBC130714B | Panasonic - DTG | FERRITE CORE 80 OHM HINGED 6.5MM | Forespørgsel |
 |
28R0480-100 | Laird-Signal Integrity Products | FERRITE CORE 150 OHM SOLID | Forespørgsel |
 |
KRCBC160928B | Panasonic - DTG | FERRITE CORE 140 OHM HINGED | Forespørgsel |
 |
742701121 | Wurth Electronics Inc. | FERRITE CORE 123 OHM SOLID 5MM | Forespørgsel |
|
28B1020-300 | Laird-Signal Integrity Products | FERRITE CORE SOLID | Forespørgsel |
 |
MS 21X14X4.5 W | Toshiba Semiconductor and Storage | FERRITE CORE SOLID 12.8MM | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers