Købe KUEP-3D35-24 med BYCHPS
Køb med garanti
KUEP-3D35-24
- Varenummer:
- KUEP-3D35-24
- Beskrivelse:
- RELAY GEN PURPOSE SPST 10A 24V
- Blyfri Status / RoHS Status:
- Indeholder lead / RoHS-kompatibel
- Tilgængelig mængde:
- 17698 Pieces
- Datablad:
- KUEP-3D35-24.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for KUEP-3D35-24, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til KUEP-3D35-24 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Tænd for spænding (maks.): | 18 VDC |
|---|---|
| Sluk spænding (Min): | - |
| Afslutningsstil: | Plug In, Quick Connect - 0.187" (4.7mm) |
| Skiftespænding: | 150VDC - Max |
| Serie: | KUEP |
| Udgivelsestid: | 10ms |
| Relæ Type: | General Purpose |
| Emballage: | Bulk |
| Andre navne: | 1393114-5 13931145 PB843 |
| Driftstemperatur: | -45°C ~ 70°C |
| Brug tid: | 15ms |
| Monteringstype: | Socketable |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 16 Weeks |
| Producentens varenummer: | KUEP-3D35-24 |
| Funktioner: | Insulation - Class B |
| Udvidet beskrivelse: | General Purpose Relay SPST-NO (1 Form X) 24VDC Coil Socketable |
| Beskrivelse: | RELAY GEN PURPOSE SPST 10A 24V |
| Kontakt Rating (Aktuel): | 10A |
| Kontaktmateriale: | Silver Cadmium Oxide (AgCdO) |
| Kontaktformular: | SPST-NO (1 Form X) |
| Spole spænding: | 24VDC |
| Spole type: | Non Latching |
| Coil Resistance: | 472 Ohms |
| Coil Power: | 1.25 W |
| Coil Current: | 51mA |
| Email: | [email protected] |
Relaterede dele til KUEP-3D35-24
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers