Købe LFB143064-100 med BYCHPS
Køb med garanti
LFB143064-100
- Varenummer:
- LFB143064-100
- Beskrivelse:
- FERRITE CORE 53 OHM SOLID 6.35MM
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 18771 Pieces
Introduktion
BYCHIPS er strømforsyningsdistributøren for LFB143064-100, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til LFB143064-100 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Type: | Round |
|---|---|
| Serie: | LF |
| Vurderinger: | - |
| Ydermål: | 0.562" Dia (14.27mm) |
| Andre navne: | 240-2136 LFB143064100 |
| Monteringstype: | Free Hanging |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Materiale: | LF |
| Fabrikantens standard ledetid: | 13 Weeks |
| Producentens varenummer: | LFB143064-100 |
| Længde: | 0.530" (13.46mm) |
| Indvendig Dimension: | 0.250" Dia (6.35mm) |
| Impedans @ Frekvens: | 53 Ohm @ 5MHz |
| Udvidet beskrivelse: | Solid Free Hanging Ferrite Core 53 Ohm @ 5MHz ID 0.250" Dia (6.35mm) OD 0.562" Dia (14.27mm) Length 0.530" (13.46mm) |
| Design: | Solid |
| Beskrivelse: | FERRITE CORE 53 OHM SOLID 6.35MM |
| Email: | [email protected] |
Relaterede dele til LFB143064-100
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
74270035 | Wurth Electronics Inc. | FERRITE CORE 275 OHM SOLID 6.9MM | Forespørgsel |
 |
LFB143064-000 | Laird-Signal Integrity Products | FERRITE CORE 120 OHM SOLID | Forespørgsel |
 |
KR16TT251512 | Panasonic - DTG | FERRITE CORE 80 OHM SOLID 15MM | Forespørgsel |
 |
7427218 | Wurth Electronics Inc. | FERRITE CORE 66 OHM SOLID | Forespørgsel |
 |
CF1-4*1.5*10 | API Delevan Inc. | FERRITE CORE 135 OHM SOLID 1.5MM | Forespørgsel |
 |
ESD-FPD-16 | KEMET | FERRITE CORE CLIP 25.4MM X 2.6MM | Forespørgsel |
 |
FSRH070140RN000B | Murata Electronics North America | FERRITE CORE 82 OHM SOLID 4MM | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog