Købe LM1894MX/NOPB med BYCHPS
Køb med garanti
LM1894MX/NOPB
- Varenummer:
- LM1894MX/NOPB
- Fabrikant:
- Beskrivelse:
- IC NOISE REDUCT SYS DYNAM 14SOIC
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 17701 Pieces
- Datablad:
- LM1894MX/NOPB.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for LM1894MX/NOPB, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til LM1894MX/NOPB via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Forsyning: | 4.5 V ~ 18 V |
|---|---|
| Leverandør Device Package: | 14-SOIC |
| specifikationer: | 10dB |
| Serie: | - |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 14-SOIC (0.154", 3.90mm Width) |
| Andre navne: | *LM1894MX *LM1894MX/NOPB 296-35393-2 LM1894MX LM1894MX-ND LM1894MX/NOPB-ND LM1894MXNOPB |
| Driftstemperatur: | 0°C ~ 70°C (TA) |
| Antal kanaler: | 2 |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 12 Weeks |
| Producentens varenummer: | LM1894MX/NOPB |
| grænseflade: | Analog |
| Fungere: | Noise Reduction |
| Udvidet beskrivelse: | Audio Noise Reduction 2 Channel 14-SOIC |
| Beskrivelse: | IC NOISE REDUCT SYS DYNAM 14SOIC |
| Applikationer: | Automotive Audio, Consumer Audio |
| Email: | [email protected] |
Relaterede dele til LM1894MX/NOPB
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
|
LM1894M/NOPB | Texas Instruments | IC DYNAM NOISE REDUCT SYS 14SOIC | Forespørgsel |
 |
SAE800G GEG | Infineon Technologies | IC TONE GONG SGL/DUAL/TRPL P8DSO | Forespørgsel |
 |
BD3812F-E2 | Rohm Semiconductor | IC SOUND PROCESSOR 2CH 14SOP | Forespørgsel |
 |
LC823425-12G1-LR-H | ON Semiconductor | IC AUDIO LSI RECORDER 128TQFP | Forespørgsel |
|
SRC4190IDBR | Texas Instruments | IC 192KHZ SAMPL RATE CONV 28SSOP | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers