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LNX2V822MSEH
- Varenummer:
- LNX2V822MSEH
- Fabrikant:
- Nichicon
- Beskrivelse:
- CAP ALUM 8200UF 20% 350V SCREW
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 13657 Pieces
Introduktion
BYCHIPS er strømforsyningsdistributøren for LNX2V822MSEH, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til LNX2V822MSEH via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsbedømmelse: | 350V |
|---|---|
| Tolerance: | ±20% |
| Overflade Mount Land Størrelse: | - |
| Størrelse / Dimension: | 3.000" Dia (76.20mm) |
| Serie: | LNX |
| Ripple Current: | 18.7A @ 120Hz |
| Polarisering: | Polar |
| Emballage: | Bulk |
| Pakke / tilfælde: | Radial, Can - Screw Terminals |
| Andre navne: | 493-9113 LNX2V822MSEH-ND |
| Driftstemperatur: | -25°C ~ 85°C |
| Monteringstype: | Chassis Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 21 Weeks |
| Producentens varenummer: | LNX2V822MSEH |
| Levetid @ Temp.: | 20000 Hrs @ 85°C |
| Blyafstand: | 1.252" (31.80mm) |
| Impedans: | - |
| Højde - Siddende (Max): | 6.024" (153.00mm) |
| Udvidet beskrivelse: | 8200µF 350V Aluminum Capacitors Radial, Can - Screw Terminals 20000 Hrs @ 85°C |
| ESR (Equivalent Series Resistance): | - |
| Beskrivelse: | CAP ALUM 8200UF 20% 350V SCREW |
| kapacitans: | 8200µF |
| Applikationer: | General Purpose |
| Email: | [email protected] |
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LNX2V153MSEJ | Nichicon | CAP ALUM 15000UF 20% 350V SCREW | Forespørgsel |
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LNX2V472MSEH | Nichicon | CAP ALUM 4700UF 20% 350V SCREW | Forespørgsel |
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LNX2V183MSEJ | Nichicon | CAP ALUM 18000UF 20% 350V SCREW | Forespørgsel |
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LNX2V562MSEH | Nichicon | CAP ALUM 5600UF 20% 350V SCREW | Forespørgsel |
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LNX2V272MSEF | Nichicon | CAP ALUM 2700UF 20% 350V SCREW | Forespørgsel |
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LNX2V332MSEG | Nichicon | CAP ALUM 3300UF 20% 350V SCREW | Forespørgsel |
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Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers